MOEMS Technology

The Lemoptix scanning mirror core device is based on MOEMS (Micro-ElectroMechanical System) technology. This technology is directly derived from the standard semi-conductor (Electronics Integrated Circuit) industry.

MOEMS-based Devices at a Glance

In the past 20 years, due to the unique properties and reliability of mechanical silicon-based MOEMS devices, many of these "invisible" components have been integrated as core devices in numerous products: A few key examples are vehicle shock sensors for air-bag actuation, pressure sensors in planes for altitude control, silicon microphones in mobile phones, direction sensors for gaming applications (e.g. Wii gaming machine)...

Semi-conductor-like Processes

MOEMS components fabrication is derived from the semi-conductor industry and therefore similar fabrication techniques and equipments are used, resulting in comparable advantages in terms of large volume manufacturing and low cost processes.

Wafer-level Hermetic Packaging

Unpackaged MOEMS devices generate many issues and considerably increase the manufacturing costs in high-volume production. . Lemoptix packaging is done on a wafer-level, meaning that thousands of devices are protected at once. The strong sealing between the transparent cap wafer and the silicon wafer holding the mirror, enables a perfect hermeticity inside the cavity containing the scanning mirror. Each of the MOEMS scanning mirrors is diced and separated using standard equipement and processes, which otherwise would be impossible in case of non-packaged devices.